Ruiyu Semiconductor's power management chips are widely used in consumer electronics, communication equipment, industrial control, and other fields. The packaging form of the power chip directly affects the product's heat dissipation performance, electrical characteristics, and applicable scenarios. This article will combine REALTEK's technical documents to systematically analyze the packaging types, technical characteristics, and selection recommendations of its mainstream power chips.

1、 The mainstream packaging form of Ruiyu power chip

1. SOP series

① SOP-8: EALTEK's RT725x series Buck converters often use this package, with a size of 5mm × 6mm and a pin spacing of 1.27mm. Its advantage lies in strong compatibility, which can achieve power output below 5W through PCB heat dissipation pads. Typical applications include router power modules.

② HSOP (Heat Enhanced SOP): If the RTQ2102 synchronous rectification controller adopts HSOP-14 packaging, the exposed copper block on the top can reduce the thermal resistance to 20 ° C/W, which is suitable for industrial power supply design of 12V/3A.

2. QFN (Quad Flat No led) package

① The 3mm × 3mm QFN-16:RT5735 DC-DC converter adopts this package and achieves a conversion efficiency of over 90% through bottom exposed solder pads (EPAD). It is commonly used for powering smartphone motherboards.

② 5mm × 5mm QFN-24: As a multi-phase controller RT3672AE, it supports 4-phase PWM output and has a current carrying capacity of 40A. It needs to be used in conjunction with copper pillar heat dissipation technology for GPU power supply.

3. BGA (Ball Grid Array) packaging

Digital power chips such as RT7285CGQ are packaged in BGA-48 with a 0.5mm pitch and integrated with PMBus interface, suitable for modular design of server power supplies, but attention should be paid to thermal stress control during the soldering process.

4. Special packaging solution

① Flip Chip: The RTB7880 car power management IC adopts flip chip technology, which shortens the heat dissipation path by 60% and meets the AEC-Q100 Grade 1 standard.

② SiP (System in Package): The recently released RTPS7101 integrates LDO, Buck, and monitoring circuits into an 8mm × 8mm SiP, reducing PCB area by 30%.

2、 Key performance indicators of packaging technology

1. Thermal design considerations

The θ JA (junction to environment thermal resistance) of QFN packaging is usually 45 ° C/W, while HSOP can be optimized to 30 ° C/W. For example, at an ambient temperature of 85 ° C, the QFN-16 package of RT8295A needs to maintain an airflow velocity of ≥ 1m/s to sustain full load operation.

2. Electrical Characteristics Influence

The parasitic inductance of SOP packaging is about 3nH, while QFN can be controlled within 1nH, which is crucial for the RT6200 synchronous buck chip with MHz switching frequency. BGA packaging can achieve low impedance distribution (<5m Ω) of power/ground plane.

3. Reliability verification data

According to the JEDEC JESD22-A104 standard, REALTEK's QFN package has a solder joint cracking rate of less than 0.1% after 1000 temperature cycles of -40 ° C~125 ° C. Industrial grade products such as RT5785GWW have been validated through 2000 hours of 85 ° C/85% RH humidity aging.

3、 Application scenarios and selection suggestions

1. In the field of consumer electronics

For smart wearable devices, priority should be given to RT5750 packaged in 1mm × 1mm WLCSP, with a thickness of only 0.6mm; for TV motherboards, it is recommended to use RT6910 packaged in TSSOP-20 with heat dissipation wings.

2. Industrial control scenario

For a 24V input system, the DDPAK-7 package of RTQ2563 can withstand a surge voltage of 60V, and when paired with a ceramic substrate, the junction temperature fluctuation is less than 15 ° C.

3. Automotive electronic adaptation

The RTQ2942Q, which complies with ISO 7637-2 standard, is packaged in TO-252-5L and integrates TVS diodes internally, which can directly cope with sudden load drop conditions.

When selecting REALTEK power chip packaging, it is necessary to comprehensively evaluate parameters such as thermal load, switch losses, and space limitations. For example, QFN is preferred for applications below 10W, HSOP/BGA is recommended for high-frequency high current scenarios, and automotive electronics require verification of the thermal expansion coefficient matching of packaging materials. With the development of heterogeneous integration technology, Ruiyu's packaging innovation will continue to promote the miniaturization and efficiency of power systems.